Prospective
Regulation 4
1. Large household appliances.U.K.
Commencement Information
I1Sch. 1 para. 1 in force at 1.7.2006, see reg. 1
2. Small household appliances.U.K.
Commencement Information
I2Sch. 1 para. 2 in force at 1.7.2006, see reg. 1
3. IT and telecommunications equipment.U.K.
Commencement Information
I3Sch. 1 para. 3 in force at 1.7.2006, see reg. 1
4. Consumer equipment.U.K.
Commencement Information
I4Sch. 1 para. 4 in force at 1.7.2006, see reg. 1
5. Lighting equipment.U.K.
Commencement Information
I5Sch. 1 para. 5 in force at 1.7.2006, see reg. 1
6. Electrical and electronic tools (with the exception of large-scale stationary industrial tools).U.K.
Commencement Information
I6Sch. 1 para. 6 in force at 1.7.2006, see reg. 1
7. Toys, leisure and sports equipment.U.K.
Commencement Information
I7Sch. 1 para. 7 in force at 1.7.2006, see reg. 1
8. Automatic dispensers.U.K.
Commencement Information
I8Sch. 1 para. 8 in force at 1.7.2006, see reg. 1
Regulation 5(2)
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.U.K.
Commencement Information
I9Sch. 2 para. 1 in force at 1.7.2006, see reg. 1
2. Mercury in straight fluorescent lamps for general purposes not exceedingU.K.
(a)10 mg for halophosphate lamps,
(b)5mg for triphosphate lamps with normal lifetime, and
(c)8 mg for triphosphate lamps with long lifetime.
Commencement Information
I10Sch. 2 para. 2 in force at 1.7.2006, see reg. 1
3. Mercury in straight fluorescent lamps for special purposes.U.K.
Commencement Information
I11Sch. 2 para. 3 in force at 1.7.2006, see reg. 1
4. Mercury in other lamps not specifically mentioned in this schedule.U.K.
Commencement Information
I12Sch. 2 para. 4 in force at 1.7.2006, see reg. 1
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.U.K.
Commencement Information
I13Sch. 2 para. 5 in force at 1.7.2006, see reg. 1
6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.U.K.
Commencement Information
I14Sch. 2 para. 6 in force at 1.7.2006, see reg. 1
7. Lead—U.K.
(a)in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead),
(b)in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, and
(c)in electronic ceramic parts (e.g. piezoelectronic devices).
Commencement Information
I15Sch. 2 para. 7 in force at 1.7.2006, see reg. 1
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC(1) amending Directive 76/769/EEC(2) relating to restrictions on the marketing and use of certain dangerous substances and preparations.U.K.
Commencement Information
I16Sch. 2 para. 8 in force at 1.7.2006, see reg. 1
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.U.K.
Commencement Information
I17Sch. 2 para. 9 in force at 1.7.2006, see reg. 1
10. DecaBDE in polymeric applications.U.K.
Commencement Information
I18Sch. 2 para. 10 in force at 1.7.2006, see reg. 1
11. Lead in lead-bronze bearing shells and bushes.U.K.
Commencement Information
I19Sch. 2 para. 11 in force at 1.7.2006, see reg. 1
12. Lead used in compliant pin connector systems.U.K.
Commencement Information
I20Sch. 2 para. 12 in force at 1.7.2006, see reg. 1
13. Lead as a coating material for the thermal conduction module c-ring.U.K.
Commencement Information
I21Sch. 2 para. 13 in force at 1.7.2006, see reg. 1
14. Lead and cadmium in optical and filter glass.U.K.
Commencement Information
I22Sch. 2 para. 14 in force at 1.7.2006, see reg. 1
15. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.U.K.
Commencement Information
I23Sch. 2 para. 15 in force at 1.7.2006, see reg. 1
16. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.U.K.
Commencement Information
I24Sch. 2 para. 16 in force at 1.7.2006, see reg. 1
17. Lead in linear incandescent lamps with silicate coated tubes.U.K.
Commencement Information
I25Sch. 2 para. 17 in force at 1.7.2006, see reg. 1
18. Lead halide as radiant agent in High Density Discharge lamps used for professional reprography applications.U.K.
Commencement Information
I26Sch. 2 para. 18 in force at 1.7.2006, see reg. 1
19. Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).U.K.
Commencement Information
I27Sch. 2 para. 19 in force at 1.7.2006, see reg. 1
20. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps.U.K.
Commencement Information
I28Sch. 2 para. 20 in force at 1.7.2006, see reg. 1
21. Lead oxide in glass used for bonding front and rear substances of flat fluorescent lamps used for Liquid Crystal Displays.U.K.
Commencement Information
I29Sch. 2 para. 21 in force at 1.7.2006, see reg. 1
OJ No. L186, 12.7.91, p.59.
OJ No. L262, 27.9.76, p.201.