[F1Quantum computing and advanced materials goodsU.K.
This section has no associated Explanatory Memorandum
9. “Decapsulation” equipment for semiconductor devices.
Note: “Decapsulation” means the removal of a cap, lid, or encapsulating material from a packaged integrated circuit by mechanical, thermal, or chemical methods.]
Textual Amendments
F1Sch. 2E inserted (14.4.2022 at 5.00 p.m.) by The Russia (Sanctions) (EU Exit) (Amendment) (No. 8) Regulations 2022 (S.I. 2022/452), reg. 1(2), Sch. Pt. 1